Yueya Semiconductor CEO was invited to attend the "Advanced Packaging Materials Technology Development and Innovation Forum" and deliver a keynote speech
On July 7, 2022, the "Advanced Packaging Materials Technology Development and Innovation Forum" was held in Dongguan. With the theme of "New Materials, Core Opportunities", the forum was co sponsored by the Integrated Circuit Materials Industry Technology Innovation Alliance, Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center, Guangdong Dawan District Integrated Circuit and System Application Research Institute and the National Electronic Circuit Substrate Engineering Technology Research Center in Dongguan Songshanhu National High tech Zone, and co sponsored by Guangdong Shengyi Technology Co., Ltd.
As an important supplier of global IC packaging boards, Mr. Chen Xianming, CEO of Yueya Semiconductor, was invited to attend this forum and delivered a keynote speech entitled "The Urgency of Supply of High end IC Packaging Boards and Replacement of Domestic Materials".
Mr. Chen Xianming pointed out in his speech: "The formation of today's semiconductor industry pattern is mainly due to the first two industrial transfers in semiconductor history. The first two rounds are from analog to digital, and the third round is digital analog dual wheel drive. When taking us to perceive the world and generating a lot of information for more intelligent and digital processing, we need to use analog and digital chips, which is a big opportunity in our entire Chinese semiconductor industry chain ”£
China is the region that has the most opportunity to undertake the golden development of the third round of semiconductor industry for ten years. From the perspective of the development of the entire semiconductor industry, China has accumulated a large number of application needs. What we are facing is how to transform the requirements put forward by the design institute into manufacturing capacity. But today, China's traditional manufacturing capacity cannot solve such a demand. At present, it mainly depends on the United States, Europe and Japan to solve it. In extreme cases, we will become "stuck" and lack self-sufficiency. Among the materials in China's semiconductor supply chain, IC packaging carrier plates and core raw materials are the weakest links, which need to focus on development and strengthen the weak ones!
In 2020, with the gradual promotion of 5G construction and application, the demand in data center, intelligent driving, AI, high-performance computing and other fields will continue to rise, and the market size of the main core IC (CPU, GPU, FPGA, ASIC) it needs will meet the opportunity of rapid growth. From the feedback information of each supply chain, FCBGA packaging carrier (ABF carrier) will continue to be in short supply until 2023, or even 2025. "
Combining the development pattern and future development trend of China's semiconductor, Mr. Chen Xianming then introduced the industrial position and contribution of Yueya Semiconductor in the domestic supply chain: "In addition to its factory in Founder PCB Industrial Park, Yueya Semiconductor also has two other wholly owned production bases. One is in Chongchuan District, Nantong City, Jiangsu Province (Nantong Yueya Semiconductor Co., Ltd.) , mainly to meet the needs of our strategic customers in the power management module of the base station and the domestic low-end FCBGA. The other is Zhuhai Yuexin Factory (Zhuhai Yuexin Semiconductor Co., Ltd.), which just entered the equipment installation two days ago, mainly to meet the needs of domestic high-end RF carriers and high-end FCBGA.
At present, Yueya Semiconductor focuses on three types of products: first, RF/pan RF products, which use Yueya's original copper pillar method to meet the requirements of high reliability and high heat dissipation. The second is the ECP module produced by embedded method, which is mainly faced with the power supply management module. It is a power management solution with high heat dissipation, low time delay and high frequency for customers of the world's leading power management module. The third is FCBGA (ABF carrier plate). Yueya started mass production of FCBGA in June 2021. Today, we provide FCBGA mass production solutions for all domestic enterprises that cannot buy carrier plates from abroad due to sanctions.
Correspondingly, Yueya Semiconductor addresses three types of demand for IC packaging carriers in the domestic semiconductor supply chain: the first type is RF products. After 2012, Yueya's RF products accounted for about 1/3 of the global output value. According to the plan, Yueya will also account for about half of the pan RF products in the world in the future. The second type is embedded power modules. Currently, Yueya's shipments account for about 50% of the world's total. The third category is FCBGA, which focuses on providing solutions to domestic supply chains. Faced with the FCBGA needs of overseas customers, Yueya is in the initial stage. It is unwilling to be bound by others in terms of capacity and restricted by others in terms of technology at this time. What we hope more is that our FCBGA can develop and grow together with domestic application end and domestic material end. "