On December 13, 2019, China (Zhuhai) Integrated Circuit Industry Summit Forum 2019 was held in Zhuhai International Convention and Exhibition Center. Many industry experts and practitioners gathered in Zhuhai to interpret the current development situation of IC and explore the future of Zhuhai Industry Summit Forum, Zhuhai Advanced IC Innovation Institute held the inauguration ceremony, Shanghai Institute of Microsystems of Chinese Academy of Sciences and Zhuhai held the signing ceremony of IC project achievements transformation. In addition, many major projects OF Zhuhai INTEGRATED CIRCUIT industry were signed at the conference.
As a major supplier of international packaging substrate, Mr. Chen Xianming, CEO of our company, was invited to attend the summit forum and shared "Exploration and practice in the field of advanced packaging".
"When VietAsia was born 15 years ago, the entire domestic semiconductor industry was in the stage of simple replication and reverse. At that time, an Israeli company came to China looking for a partner, and my unit cooperated with them." CEO Chen Xianming recalled that from China to Israel spanned the whole Asia, so the company was named VietAsia, meaning: Go out of Asia, link to the world.
"After 15 years of sticking to my original choice, I finally saw the rise of Chinese semiconductors. However, when we look at the whole Chinese semiconductor industry chain, we will find that the biggest problem is the imbalance of cold and heat in the industrial chain.
"The next hard nut for China's semiconductor industry is packaging substrates, wafer manufacturing." CEO Mr. Chen Xianming believes.
"In the same way that the test industry was subsumed into the 'closed test industry' statistic, for many years, packaging substrates were not reported in many industry reports, and many people attributed this to the PCB industry. But packaging substrate and PCB are very different. China's PCB industry accounts for 60% of the world, but China's packaging substrate only accounts for 2.8% of the world.
It takes up to two months to make a four-layer plate before the Viet Na goes into the packaging substrate. When we were founded, we reduced this period to one month. Now our lead time is one week.
Vietasia's unique technology is a core - less substrate. Traditional chip packaging is based on a core substrate with a double-sided copper foil containing an insulating layer in the middle. Our first PRODUCT breaks the CORE-based approach by replacing the laser-drilled connection with a micron-scale copper column connection, providing a high-performance substrate solution for RF devices." CEO Mr. Chen Xianming pointed out.
"The success of the industrialization of coreless packaging substrate technology has broken the market monopoly of foreign high-end IC packaging substrate manufacturers and realized the domestic replacement of international competitors.
In addition to core-less substrates, Viet Asia also has wafer embedding, filters, connectors, components and other technical solutions. In the RF front-end chip, power management chip embedded packaging, VietAsia has become a major solution provider.
In the first half of this year, research firm Yole released a forecast for the value of embedded naked chip packaging, citing a 2018 base of $21 million. I think Yole's predictions for embedded bare-chip packaging are too conservative. Vietnam Asia did $1.5 million in 2018. If that's right, then Vietnam Asia does 70 percent of the global market." CEO Chen Xianming said with a smile.